Chemical and functional materials
Plating Solutions
From ultra-precision semiconductors to advanced electronics, we push the limits of surface treatment technology.
LT Metal’s advanced plating solution technology enables high-density, high-reliability packaging.
We provide high-performance plating solutions for fine-circuit formation and surface reliability in next-generation semiconductors and electronic components.
Building on our accumulated expertise in chemical material synthesis and precise electrochemical control, we develop and supply plating processes with outstanding uniformity, filling performance, and durability.
With customized additive formulations optimized for each customer’s specifications and process conditions, and stable quality control, we help realize next-generation electronic components.
Plating Material Application Guide
Which plating material should you choose?
The choice of plating material depends on the product’s operating environment (current, temperature, chemical exposure), required thickness, substrate material, and environmental regulations.
| Application | Plating Material | Reason for Selection |
|---|---|---|
| Semiconductors | Au, Ni, Cu, Sn, Sn/Ag | Reliability, oxidation and corrosion resistance, high electrical conductivity, and low contact resistance |
| Printed Circuit Boards | Au, Ag, Ni, Cu | Solderability·Contact |
| Selective Plating for Connectors·Contacts | Au, Ag, Pt, Pt, Ru, Ni, Cu | Wear resistance, corrosion resistance, low contact resistance |
| Medical·Implant Components | Pt, Rh | Biocompatibility·Corrosion resistance |
Why LT Metal
Three Design Capabilities
Global customers choose LT Metal because our design capabilities in composition, structure, and reliability allow us to deliver the performance and quality they require. This is LT Metal’s core competitive strength.
We Design Composition
The chemical composition, pH, current density, and temperature of a plating solution determine the quality of the plated layer. As a manufacturer of precious metal chemical materials, LT Metal deeply understands the relationship between material properties and process conditions, and designs chemical compositions tailored to each customer’s plating process.
We Design Structure
The microcrystalline structure and interfacial adhesion of the plated film are key factors that determine the electrical properties and reliability of the finished product. With additive formulation technology that promotes void-free filling and uniform surface morphology, LT Metal designs nano-scale particles and dense crystal structures, achieving defect-free plating even in advanced fine patterns.
We Design Reliability
We offer a material lineup that complies with global environmental regulations such as RoHS and REACH. Our precious metal recovery service for spent plating solutions helps customers achieve their ESG goals (supply of UL-certified products) while reducing costs.
