Thin film materials

From display panels to AI semiconductor chips — precision thin-film materials by LT Metal.

Material properties decide display performance.

At LT Metal, we push that precisionone step further every day.

Thin-film materials form functional metal layers from a few nanometers to a few micrometers thick, deposited by sputtering or evaporation. The purity, density, crystal structure, and compositional uniformity of the target directly determine the electrical and optical properties of the film. Across semiconductors, displays, solar cells, and medical devices, thin-film material quality determines both product performance and manufacturing stability. LT Metal brought ITO target production to Korea with its own powder synthesis technology. Building on years of metal alloy expertise, we deliver consistent quality and stable performance in both ceramic and metal targets.

Process Selection Guide

Sputtering vs. Evaporation – Optimal Materials by Process

Process Requirements LT Metal Materials Main Applications
Sputtering Large-area uniformity, low particle
High purity, high density
Low resistance, etchability·high adhesion
High transmittance, high reflectance
Pure metal and alloy targets
Ceramic targets
Hybrid targets
TFT gate, S/D interconnects
Buffer, diffusion barrier, capping layer
Active layer, transparent electrodes
OLED anode
cathode
Low-reflection and high-reflection films
Evaporation High purity, low gas content Ag(Disk, Pellet, Granule)
Pt Pellet
OLED Cathode
R&D use

Display vs. Semiconductor vs. Solar – Optimal Materials by Industry

Industry Requirements LT Metal Materials Main Applications
Display Large-area uniformity, low particle
High purity, high density, low gas content
Low resistance, etchability·high adhesion
High transmittance, high reflectance
Pure metal and alloy targets
Ceramic targets
Hybrid targets
TFT gate, S/D interconnects
Buffer, diffusion barrier, capping layer
Active layer, transparent electrodes
OLED anode
cathode
Low-reflection and high-reflection films
R&D use
Semiconductor High purity, low gas content
Large-area uniformity, low particle
Grain control
Pure metal and alloy targets Interconnects, barrier, diffusion prevention
Bumping
EMI-Shield
R&D use
Solar Large-area uniformity, low particle
High purity, high density
High mobility, low resistance, high transmittance
Ceramic targets
Pure metal targets
Crystalline Si TCO layers
Electrodes and seed layers

Why LT Metal

Three engineering capabilities

Global customers choose LT Metal because our engineering capability in composition, structure, and reliability delivers the performance and quality they specify. That is our core strength.

We engineer composition.

The alloy composition and impurity level of a target directly determine the electrical and optical properties of the film. LT Metal analyzes your deposition conditions — temperature, pressure, and power density — and engineers a target with the composition to match.

We engineer structure.

Our proprietary technology synthesizes the powders for ITO and other functional targets in-house, so particle size distribution, oxygen content, and sintered density are engineered from the start. The result is a target structure that suppresses particle generation and arcing.

We engineer reliability.

We do more than supply material. We engineer a reliability support system around your deposition process: process condition reviews, prototype evaluation, and root-cause analysis when problems arise.

This site is registered on wpml.org as a development site. Switch to a production site key to remove this banner.