Thin film materials
Overview
Metal Target Overview
Today’s semiconductor interconnects and display electrodes demand finer features, lower resistance, and higher reliability. Building on high-purity refining and plastic working technologies, LT Metal offers a wide range of target materials—from interconnect materials such as Cu, Mo, Ti, and Al to precious metals such as Ag, Au, and Pt—covering single metals as well as alloys and other special specifications, all backed by thorough quality control to meet our customers’ expectations.
| Industry | Product | Composition | Purity | Shape | Main Applications |
|---|---|---|---|---|---|
| Display | Ag | Pure & Alloy | 4N5 or higher | Planer & Rotary Pellet & Granule & Disk |
OLED Anode & Cathode |
| Cu | Pure | 4N5 or higher | Planer & Rotary | Gate, S/D interconnects | |
| Mo | Pure | 3N5 or higher | Planer & Rotary | Barrier, Capping | |
| Ti | Pure | 3N5 or higher | Planer & Rotary | Barrier, Capping | |
| Al | Pure & Alloy | 4N or higher | Planer & Rotary | S/D interconnects, reflective electrodes | |
| Cr | Pure & Alloy | 4N or higher | Planer & Rotary | Photo Mask | |
| Semiconductor | Ta | Pure | 4N5 or higher | Planer | Diffusion barrier |
| CuMn | On request | 6N or higher | Planer | Interconnect film | |
| Au | Pure | 4N5 or higher | Planer | Bumping | |
| Cu | Pure | 4N5 or higher | Planer & Rotary | EMI-Shield | |
| SUS | 304L, 316L | 3N or higher | Planer & Rotary | EMI-Shield | |
| Ni | Pure | 3N5 or higher | Planer | Back-end | |
| Pt | Pure | 4N or higher | Planer | Wafer deposition |
Why LT Metal
Three engineering capabilities
Global customers choose LT Metal because our engineering capability in composition, structure, and reliability delivers the performance and quality they specify. That is our core strength.
We engineer composition.
The alloy composition and impurity level of a target directly determine the electrical and optical properties of the film. LT Metal analyzes your deposition conditions — temperature, pressure, and power density — and engineers a target with the composition to match.
We engineer structure.
Our proprietary technology synthesizes the powders for ITO and other functional targets in-house, so particle size distribution, oxygen content, and sintered density are engineered from the start. The result is a target structure that suppresses particle generation and arcing.
We engineer reliability.
We do more than supply material. We engineer a reliability support system around your deposition process: process condition reviews, prototype evaluation, and root-cause analysis when problems arise.
